In order to realize your innovations for new technologies and products, we assist and support your R&D by providing our techniques and knowledge, particularly printable electronics techniques, interconnect techniques, thin film fabrication, plating and etc.
Printing of semiconductor devices under ambient atmospheric conditions is a promising method for large-area, low-cost fabrication of flexible electronic products. We provide you novel printing and self-assembly techniques for flexible printed electronics such as printable electronic circuits and organic thin-film transistors.
Interconnect and Integration
Interconnect and integration are the indispensable techniques to develop future wearable devices. Most of flexible materials used in the future wearable devices may be sensitive for heating. Thus low-temperature integration technologies should be essential to avoid the damage caused by heat. We develop low-temperature integration technologies which are applicable to a broad range of IoT and wearable devices. We develop low-temperature integration technologies which are applicable to a broad range of IoT and wearable devices.
Test production, analysis, measurements/evaluations
According to the rapid advancements in mobile and IoT devices, the field of electronics becomes much complicated. To meet a complicated demand from customers and/or minimize development costs, we support you by providing our abilities of test fabrication, analysis, measurements and evaluations.